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1.2V & 1.2V VlO Serial NOR Flash
AG庄闲 GD25UF系列SPI NOR Flash工作电压极低，仅为1.14V至1.26V，特别适用于采用1.2V核心电压的先进SoC和处理器。这不仅简化了电源设计，还支持GD25UF与主控设备之间的直接I/O接口。
GD25UF系列支持两种工作模式：正常模式和低功耗模式。与传统的1.8V SPI NOR Flash相比，GD25UF在正常模式下功耗降低高达33%，而在低功耗模式下，功耗在相同频率条件下降低高达70%。
出色的能效表现极大延长了电池续航时间，使GD25UF系列成为可穿戴设备、智能家居及其他电池供电物联网（IoT）应用的理想选择。
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15 Results
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电压
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1.2V
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1.8V VCC, 1.2V VIO
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容量
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8Mb
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16Mb
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32Mb
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64Mb
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128Mb
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256Mb
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512Mb
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1Gb
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2Gb
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Part No
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状态
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电压
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容量
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温度(工规)
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频率(MHz)
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主要特性
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主要封装
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|---|---|---|---|---|---|---|---|
| MP | 1.8V VCC, 1.2V VIO | 2Gb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 166(x1 x2 x4),104(x2 x4 DTR) | PASSWORD,CRC,ECC,Default 4I/O,H/W RESET,WP#,Secured OTP,Suspend | SOP16 300mil,TFBGA24 5x5 ball array | |
| MP | 1.8V VCC, 1.2V VIO | 1Gb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 166(x1 x2 x4),104(x2 x4 DTR) | PASSWORD,CRC,ECC,Default 4I/O,H/W RESET,WP#,Secured OTP,Suspend | SOP16 300mil,TFBGA24 5x5 ball array | |
| MP | 1.8V VCC, 1.2V VIO | 512Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 166(x1 x2 x4),104(x2 x4 DTR) | PASSWORD,CRC,ECC,Default 4I/O,H/W RESET,WP#,Secured OTP,Suspend | SOP16 300mil,TFBGA24 5x5 ball array | |
| MP | 1.8V VCC, 1.2V VIO | 256Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 166(x1 x2 x4),104(x2 x4 DTR) | PASSWORD,CRC,ECC,Default 4I/O,H/W RESET,WP#,Secured OTP,Suspend | SOP16 300mil,TFBGA24 5x5 ball array | |
| MP | 1.8V VCC, 1.2V VIO | 256Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 133(x1 x2 x4),104(x4 DTR) | H/W RESET,Secured OTP,Suspend | TFBGA24 5x5 ball array | |
| MP | 1.2V | 128Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 208mil,USON8 4x4mm,WSON8 6x5mm,TFBGA24 5x5 ball array,WLCSP (4-4 ball array) | |
| MP | 1.8V VCC, 1.2V VIO | 128Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 200(x1 x8),200(x8 DTR) | ECC,H/W RESET,WP#,Secured OTP | TFBGA24 5x5 ball array | |
| MP | 1.2V | 64Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 208mil,USON8 3x4mm,USON8 4x4mm,WLCSP (4-4 ball array) | |
| MP | 1.8V VCC, 1.2V VIO | 64Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 200(x1 x8),200(x8 DTR) | ECC,H/W RESET,WP#,Secured OTP | TFBGA24 5x5 ball array | |
| MP | 1.2V | 32Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array) | |
| MP | 1.2V | 16Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 150mil,SOP8 208mil,USON8 3x2mm,USON8 3x4mm,WLCSP (3-2-3 ball array) | |
| MP | 1.2V | 8Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 150mil,SOP8 208mil,USON8 3x2mm,WLCSP (4-4 ball array) | |
| S | 1.2V | 256Mb | -40℃~85℃,-40℃~105℃,-40℃~125℃ | 120(x1 x2 x4),80(x4 DTR) | Default 4I/O,H/W RESET,WP#,Secured OTP | SOP8 208mil,SOP16 300mil,WSON8 6x5mm,WLCSP (4-4 ball array) | |
| S | 1.8V VCC, 1.2V VIO | 128Mb | -40℃~85℃ | 133(x1 x2 x4),104(x2 x4 DTR) | H/W RESET,Suspend | SOP16 300mil,TFBGA24 5x5 ball array | |
| S | 1.8V VCC, 1.2V VIO | 128Mb | -40℃~85℃ | 166(x1 x2 x4),104(x4 DTR) | ECC,Default 4I/O,H/W RESET,Secured OTP,Suspend | SOP16 300mil,TFBGA24 5x5 ball array |
状态说明：MP：量产阶段，UD：开发中，S：样品阶段，NR：不推荐
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